Thermal Performance Analysis and Prediction of Printed Circuit Boards

【Author】 Wan, Yi; Huang, Hailong

【Source】JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS

【影响因子】1.278

【Abstract】Printed circuit boards (PCBs) are important components of electronic devices, they play the roles of mechanical connections and electrical transmission, thermal failure is their main failure mode, the heat flow analysis and thermal reliability design are the basis and premise to improve thermal performance of PCBs. In this paper, analysis models of PCBs thermal performance are built based on the principles of fluid mechanics and the finite element method, and we obtain the influence and analysis of internal heat sources on PCBs thermal performance. The study provides a theoretical basis for PCBs thermal reliability design which can be applied to high-density Internet of Things and blockchain ICT integration.

【Keywords】Printed circuit boards; thermal reliability; thermal performance; finite element method

【发表时间】

【收录时间】2023-04-09

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